Measuring apparatus for bonding strength of semiconductor device

Abstract

Abstract PURPOSE:To read the bonding strength of the semiconductor device by grasping a carrier tape at predetermined position, simultaneously imparting impact to all junctions and detecting and indicating the conduction of the junctions. CONSTITUTION:The carrier tape 1 is disposed at the foil side at lower side, inserted at the sprocket holes into positioning pins, and is retained by insulating plates 16, 19. At this time, a stylus 15 on a substrate 14 is brought into contact with the foil 1c. The tape 1 is attracted to the end 18a of the hollow electrode rod 18, and the rod 18 is followed through a spring 19 by the vibration of a semiconductor element 3. The vibrator 32 of a vibration generator 31 is vibrated at predetermined amplitude and frequency, and the stylus 15 and the rod 18 are energized simultaneously, the opening or closing of the conducting path is detected and indicated. This configuration can determine the bonding strength criterion, can select the frequency and the amplitude of the vibration to detect it so as to prove the bonding strength. Even if the bonding junctions are multiple and remarkably approached, all can be simultaneously detected to economically improve the reliability.

Inventors

• 👤 Fumio Takahashi
• 👤 Teruo Yoneyama

Bibliographic Details