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JPS5618446A Expired / Lapsed JP ⏱️ 0.0 years remaining

Formation of spherical salient electrode

Assignee: Hitachi Ltd
•
Filing: 1979-07-25
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Granted: —
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Expires: 1999-07-25
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Abstract

Abstract PURPOSE:To prevent retention of etched base film under a spherical salient electrode and to form a spherical salient electrode in high yield by forming a resin film on a base metal film under the electrode, removing the resin layer of the salient electrode forming part and plating metal on the part. CONSTITUTION:An electrode base layer 4 is evaporated on a substrate 3 formed with a wire and a protective film 2 thereon. Then, a polyamide resin is rotatably coated by a rotary coating unit or the like, is heated to form a resin layer 9, a photoresist 5 is then coated thereon, a salient electrode forming part is perforated thereat, and is etched to form a hole 10 for exposing the layer 4. A metal such as tin or the like is plated at 11 on the part, the resist 5' and the base electrode film 4 retained at the lower side are removed, and are then heated to form a spherical salient electrode 13. Since the resin film 9 is relatively thick, even if the plated metal is horizontally extended, the resist thereunder can be easily removed. In this manner, it can prevent the retention of etched electrode base film and form a spherical salient electrode in high yield.

Inventors

  • 👤 Hiroaki Okudaira
  • 👤 Toshio Kobayashi

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 08:46
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/20; H10W72/251

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