Thin film type thermal head

Abstract

Abstract PURPOSE: To obtain a mass-producible, reliable and inexpensive head by using two- layer film of Cr or NiCr and Cu as a feeding conductor of the thin film type thermal head. CONSTITUTION: A heating resistor film is formed on the insulating substrate 1, the lower side layer conductor film of Cr or NiCr is provided on it, and Cu conductor film 9 is evaporated onto it. Next the patterning and wear-resisting protective film 4 is formed. Moreover the Au plating film 7 is provided on the Cu conductor film 9, and the diode lead 8 is connected to the film 7. Since the formation of the Au plating film 7 is performed after the formation of the wear-resisting protective film 4, not any reaction between Au and Si-Ta films takes place. By this, the quantity of used expensive Au can be minimized, and problems such as a reaction between the Au and the heating resistor film and a Cr diffusion or the like can be solved. COPYRIGHT: (C)1981,JPO&Japio

Inventors

• 👤 Keizaburo Kuramasu
• 👤 Masaji Arai

Bibliographic Details