Multilayer wiring structure and its manufacture

Abstract

Abstract PURPOSE:To eliminate inferior wiring in a multilayer wiring system by connecting the first aluminum layer and the second aluminum layer together through intermediary of an aluminium chelate cured layer. CONSTITUTION:An aluminum wiring layer 2 is provided on a silicon substrate 1 and then is coated with a silicon dioxide film 4 with an opening 5 provided. An aluminium chelate obtained by solving aluminium powder in an organic solvent is applied through rotation process to form an aluminium chelate layer 7 with a smooth surface. A solvent is evaporated into a cured chelate. If the aluminium chelate layer is irradiated with a metallic mask 8 working as a shield, an exposed part is oxidized into aluminium trioxide 10 while the unexposed part remains as an electroconductive layer 9. Next, the second aluminium wiring 3 is formed. In this manner, the second layer of aluminium wiring is provided on a stepless surface, thus eliminating wire breakdowns and inferior wiring.

Inventors

• 👤 Takahiko Takahashi
• 👤 Akio Anzai

Bibliographic Details