Molded sealing material

Abstract

Abstract PURPOSE: To provide a molded sealing material which can be molten and bonded to a sealing part by heating and, at the same time, can be cured to exhibit a sealing function, by a method wherein a speified thermosetting resin compsn. contg. a hardener exhibiting activity at an elevated temperature is molded into a shape in an uncured or semi-cured state. CONSTITUTION: An acrylonitrile-butadiene copolymer (B) contg. a predetermined amount of carboxyl groups at its terminal or in the polymer chain is mixed or reacted with 100pts.wt. epoxy resin in such a proportion as to give 10wt% component (B) based on the combined amount of the component (A) and the component (C) mentioned below. Then 0.5W20pts.wt. hardener (C), which is stable at a room temperature and exhibits activity at an elevated temperature (e.g. dicyandiamide or thiourea), is added to the resulting mixt. or reaction product. The resulting thermosetting resin compsn. is molded into a string or a film in an uncured or a semicured state by using an extruder etc. to produce the desired molded sealing material. COPYRIGHT: (C)1981,JPO&Japio

Inventors

• 👤 Kiyoshi Saito
• 👤 Masahito Shimizu
• 👤 Norio Kawamoto

Bibliographic Details