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JPS56130474A Expired / Lapsed JP ⏱️ 0.0 years remaining

Dry etching apparatus

Assignee: Hitachi Ltd
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Filing: 1980-03-14
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Granted: —
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Expires: 2000-03-14
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Abstract

Abstract PURPOSE: To reduce the amount of an etching gas used and carry out uniform etching apparatus with guide means for guiding the gas so that it flows vertically from an upper part of each substance to be treated. CONSTITUTION: Most of feed pipe 29 put in treatment chamber 15 is placed between circular electrode table 23 and electrode 26, and each cylindrical guide member 31 made of insulating material is vertically supported so that the axial core passes through the center of substance 30 to be treated. Chamber 15 is evacuated with exhaust pipe 16, and while blowing an etching gas into each member 31 from pipe 29, power is supplied to table 23 from a high frequency power source. At this time, the gas flows in the arrow 32 direction and covers each substance 30 from the center toward the outside. Thus, a smaller amount of the etching gas is used, and uniform etching can be carried out. COPYRIGHT: (C)1981,JPO&Japio

Inventors

  • 👤 Toru Otsubo
  • 👤 Susumu Aiuchi

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 21:20
CPC Classifications
—

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