Manufacture of semiconductor device for photoelectric conversion

Abstract

Abstract PURPOSE:To exactly position a lens and to reduce a cost for the manufacture by a method wherein a plurality of the photoelectric conversion units are formed on a semiconductor wafer at fixed intervals, and the lens means are formed on the conversion units by pressing to the wafer the metal mold in which lens materials are burried corresponded to those conversion units. CONSTITUTION:The plural photoelectric conversion units 2 are formed at fixed intervals on a silicon wafer with the surfaces of the units made smooth, and the metal mold 3 is arranged on the side of the formation of the units 2. With this construction, the metal mold 3 is formed with lens receiving parts 4 corresponding to the conversion units 2, and lens materials 5 of molten glass or transparent resin or the like is filled in the receiving parts 4, with the surface heaped up. Then, the conversion units 2 and the materials 5 are contacted with each other by piling the wafer 1 and the metal mold 3 together using a concave 6 formed on the periphery of the metal mold 3 and cooled to solidify the materials 5 and to make the lens means 7 to be produced on the conversion units 2. Thereafter, the conversion units 2 are separated into an individual one, and the lens means 7 on the peripheries are surrounded by opaque resins.

Inventors

• 👤 Takeo Shimada

Bibliographic Details