Patent US5014529A successfully refreshed from Google Patents.
JPS5599731A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Method of assembling electronic device and lead frame used for assembly
Assignee: Hitachi Ltd
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Filing: 1979-01-26
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Granted: —
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Expires: 1999-01-26
Abstract
Abstract PURPOSE: To prevent the short circuit trouble at a semiconductor chip edge caused by effluent solder by forming a penetrating hole at the position of a lead piece joined via the solder layer of a semiconductor chip. CONSTITUTION: Near the end of the lead piece 21 of a lead frame, a penetrating hole 21a is formed, and putting the part of the penetrating hole on a projected electrode 31 and heating them, they are joined by a solder layer 4. An excess solder layer 4 gathers in the penetrating hole 21a and a trouble that solder flows to the edge part of a semiconductor chip can be avoided. COPYRIGHT: (C)1980,JPO&Japio
Inventors
- 👤 Tasuku Unno
- 👤 Masami Kiyono
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-08 10:23
CPC Classifications
—
Claims Analysis
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References Cited (Backward Citations)
JPS6029218A
Cited
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