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JPS5596643A Expired / Lapsed JP ⏱️ 0.0 years remaining

Tip for bonding wire

Assignee: Toshiba Corp
•
Filing: 1979-01-17
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Granted: —
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Expires: 1999-01-17
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Abstract

Abstract PURPOSE: To prevent a wire from being broken at wire bonding time by rounding the angles of the recess and peripheral end formed at the end of a tip for bonding the wire. CONSTITUTION: The outer and inner peripheral edges 14A, 11B at the end of, the boundary 12A between the curved surface 8 having large diameter provided and semi-circular portion 7 provided at the end of, and the boundary 13A between the semi-circular portion 7 and a through hole 6 provided at the end of a tip 10 are rounded. Thus, when the tip is moved, a wire is contacted with the inner surface of the tip, but not cut. Accordingly, the bonding work can be efficiently proceeded. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Osamu Okawa
  • 👤 Takatoshi Nishikawa

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-01 13:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756

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