Film-forming coating solution

Abstract

Abstract PURPOSE: To provide a film-forming coating solution having low melting point and a good workability by a method wherein a water-insoluble solvent having soecified melting and boiling points is added to a ladder organosilicone polymer having phenyl gp. and o-dimethoxybenzene. CONSTITUTION: A film-forming coating solution consists of (A) polyphenylsilsesquioxane of the formula or a ladder organozilicone polymer essentially consisting of basic structural unit of above polymer and a mixed solvent consisting of (B) 50W99wt% of o-dimethoxybenzene and (C) 1W50wt% of a water-insolble solvent with m.p. of 20°C or lower and b.p. of 185W225°C. (C) is added to compensate insufficient solubility and film-forming property at room temperature of (B) whose m.p. is 22.5°C. As (C), water-insoluble solvent having above described m.p. and b.p. is preferably used. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Takeshi Watanabe
• 👤 Ryoichi Sudo
• 👤 Fusaji Shoji
• 👤 Ataru Yokono
• 👤 Tokio Isogai

Bibliographic Details