Soldering device

Abstract

Abstract PURPOSE: To shorten the conveying distance as far as possible, and perform soldering effectively, by transferring the substrate holder on guide rails, and operating the ascending and descending motions of the vertical travel lever and inclining and flat moving motions of the front and rear variable rails by following up mutually. CONSTITUTION: A vertical travel level 11, and front variable rail 12 and rear variable rail 12' of which inner end part is fitted to this vertical travel lever 11 and outer end part is inclined upwards are disposed on the upper part on the both sides of a solder bath device 10. A conveying substrate holder 7 is transferred on a fixed guide rail 6, and descending and ascending motions of the vertical travel lever 11 and the inclining and flat moving motions of the variable rails 12, 12' are manipulated by following up mutually, so that the vertical motion of the holder 7 is superposed on the conveying speed of the printed substrate. Also, by using device 10 equiped with a dip overflow port bath 28 for forming a solder overflow surface corresponding to the conveying track of the printed substrate, soldering or printed substrate may be preformed effectively. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kenji Kondo

Bibliographic Details