Nail head bonding process

Abstract

Abstract PURPOSE: To improve the workability of a nail head bonding process by cooling a hydrogen supplying tube to a torch by an electronic cooler. CONSTITUTION: A direct current is applied to an electronic cooling element 9 to thereby cool a cooling plate 10 to approx. -30°C. to thereby retain hydrogen fed through a tube 14 brazed to the plate 10 to a torch 3 below the freezing point so as to dew steam contained therein and to thereby remove it into a reservoir 15. When a gold ball is formed by hydrogen flame 4 produced by the hydrogen thus dried, no foreign material is adhered onto the surface to thereby conduct preferable nail head bonding process. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Morihisa Nakane
• 👤 Isamu Yamamoto

Bibliographic Details