Semiconductor

Abstract

Abstract PURPOSE: For facilitating connection, to provide a conductor layer and a sealing metallized layer on the inner surface of a ceramic cap before covering a ceramic substrate having single or multi-layer wiring with said ceramic cap. CONSTITUTION: Inner wirings 2 and 3, through hole wirings 4, surface layer wirings 6 and power supply wiring conductors 16 are provided on a ceramic substrate 1 in usual manner, and sealing metallized layers 13 are formed at the ends thereof. Next, said metallized layers are covered with a ceramic cap 100 which are made of the green mixture sheet of alumina and organic binder, and power supply conductor layer 90 and metallized layers 110 of the fine particles of W placed on the inner side of said sheet by printing method, with a clearance provided under said conductor layer 90. Construction is made as described heretofore, IC chip 8 is fastened on said substrate 1, a given mode of wiring is completed, said cap 100 is placed, said conductors 90 and 16 are contacted, and said metallized layers 110 and 13 are soldered 13. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Toyoji Tsunoda
• 👤 Masao Mitani
• 👤 Akizo Toda
• 👤 Takeshi Fujita
• 👤 Masanori Nakamura

Bibliographic Details