Package of semiconductor

Abstract

Abstract PURPOSE: To make the sealed section thinner by resin molding with a dam provided on the lead and the film facing thereof after a semiconductor at the tip of an open support metal lead is bonded on a flexible film. CONSTITUTION: A flexible film 12 made of polyimide and the like is fastened on a portion of the surface extended from the concave part of a rigid body 17 made up of a metal plate or the like having a concave part at the center thereof through an adhesive layer 16. Then, an open support metal lead 14 is bonded on the film through an adhesive layer 13 and the tip thereof is located at the concave part of the rigid bidy 17. Subsequently, a semicondcutor 11 is housed in the concave part and an electrode provided thereon is connected to the tip of the lead 14 through a joint 15 by the gang bonding method. Then, a resin-insulated dam 18 is provided on the lead and the film facing thereof by a screen printing surrounding the semiconductor 11 and hardened. Thereafter, resin is poured into the concave part to seal the semiconductor 11 checking the outflow thereof with the dam. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Isao Fukuda

Bibliographic Details