Solder for semiconductor

Abstract

Abstract PURPOSE: To obtain a solder for semiconductor having a high reliability, by adding a fixed amount of Ca into a solder containing In or Pd and Sn as a main component. CONSTITUTION: Ca is added into a solder base material of Pd-Sn alloy, Pd-In alloy, et.c, in the concentration of 50W300ppm. In the concentration less than 50ppm, the solder is easily oxidized and the mechanical strength is not improved, and in more than 300ppm, the extensibility becomes lower and a strain stress caused by the difference of thermal expansibilities between the base plate and the semiconductor chip is not relaxed sufficiently. Further, the excessive mechanical strength causes a crack on the chip. As the solder has an excellent anti-thermal wearing, absorbability of strain stress and anti-oxidizability, and also it does not cause crack on the chip of breaking the junction part, highly reliable junction is obtained with this solder. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kisaku Nakamura
• 👤 Norio Ozawa
• 👤 Akio Hori

Bibliographic Details