Solder for semiconductor

Abstract

Abstract PURPOSE: To relax creation of stress by dispersing powder of Mo or W, or short fiber into solder. CONSTITUTION: Powder of Mo or W, or short fiber of 0.5W20wt% is added into solder of Sn single component or Sn-Pd alloy type, and is dispersed. When the additive is less than 0.5wt%, improvement of strength at the soldered junction part and relaxation effect of stress are not expected, and when it is more than 20wt%, it becomes fragile. For bonding of metal plate and semiconductor chip with this solder having the above constitution, as the thermal expansivity of Mo or W powder or of short fiber in the solder is in close to that of the chip and also the expansivity of the main component is in close to that of the metal plate, the difference of thermal expansibility between the plate and chip becomes small and the strength of solder itself is enforced by the dispersion of Mo or W powder. So the mechanical strength at the junction part is improved and also elastic deformation becomes possible in some extenet. Therefore a highly reliable junction is obtained. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Yoshiyasu Koike
• 👤 Kisaku Nakamura
• 👤 Norio Ozawa
• 👤 Susumu Watanabe

Bibliographic Details