Integrated circuit for microwave

Abstract

Abstract PURPOSE: To obtain a device of simple construction and high performance, by fitting a metal piece in a recess on a metal body through a perforated hole of an insulating plate, fixing the insulating plate on the metal body, and placing a circuit unit on the top of the metal piece. CONSTITUTION: A strip line 2 of prescribed pattern in provided on the top of an alumina substrate 1 and a grounded electroconductive member 3 is coated on the bottom of the substrate to manufacture an integrated circuit substrate 4. The substrate 4 is fixed on a grounding metal plate 6. A quadrangular hole 10 is perforated through the substrate 4. A recess 11 of the same form and position as the hole 10 is provided on the metal plate 6. A metal piece 12 is tightly fitted into the recess 11 through the hole 10. Both the ends of the top of the metal plate 12 are calked to secure the substrate 4 and the metal plate 6 on each other. A semiconductor chip 13 is mounted on the top of the metal piece 12 so that the tops of the chip 13 and the substrate 4 are located on the same plane. The chip and the substrate are connected to each other through wires 14. This results in obtaining an integrated circuit device for microwave which has a simple construction, minimum grounding distance, good heat radiation and high performance. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Masayoshi Kanazawa

Bibliographic Details