Manufacture of semiconductor device

Abstract

Abstract PURPOSE: To simplify a process and to enable a continuous testing of semiconductor pellets on a tape, by coupling the pellets to a lead frame of copper leaf, bonding the frame on an insulating film and cutting off lead pieces. CONSTITUTION: The bump electrodes of semiconductor pellets 11 are coupled to numerous lead pieces 101 of a lead frame 10 made of copper leaf. An epoxy resin is coated on the pellets. A polyester film 13 is bonded on the lead frame. The lead pieces are punched at their bottoms out of the frame 10 so that the lead pieces are electrically isolated from one another. The pellets are then tested. Completed tape-carried devices are separated from one another or exfoliated from the tape before the devices are put in operation. According to the present method, an expensive polyimide film is not needed, the number of steps is reduced, and the pellets can be continously tested as they remain bonded on the tape. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Toru Kawanobe

Bibliographic Details