Semiconductor device

Abstract

Abstract PURPOSE: To easily mount even a semiconductor chip with a number of electrodes by utilizing a film-carrier system, by severally forming each finger for connecting external wiring to the both surfaces of a carrier tape. CONSTITUTION: Each projection electrode 9 of a semiconductor chip 8 is each positioned at the connecting end portions of each finger 5 formed on an upper surface of a carrier tape 7 and contacted and each projection electrode 10 at the connecting end portions of each finger 6 made up on a lower surface of the carrier tape 7 and contacted, and the electrodes and the connecting end portions are bonded by means of thermal pressure adhesion from the upper surfaces of each finger 5. Each projection electrode 9 and 10 of the semiconductor chip 8 is simultaneously connected to each finger 5 and 6 built up on the both surfaces of the carrier tape 7, and mounting is completed. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Miyoshi Yoshida

Bibliographic Details