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JPS5566947A Expired / Lapsed JP ⏱️ 0.0 years remaining

Self-curing solid resol resin composition and its preparation

Assignee: Panasonic Electric Works Co Ltd
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Filing: 1978-11-15
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Granted: —
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Expires: 1998-11-15
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Abstract

Abstract PURPOSE: To obtain a self-curing solid resol resin of constant quality readily, by incorporating a novolak resin into a dehydrated and concentrated revol resin, which is the reaction product of a phesol with formaldehyde. CONSTITUTION: A phenol (p) is condensed with formaldehyde (F) in the presence of an alkali catalyst or a neutral salt at a molar ratio of (F) to (P) of 1.5W2.5:1 to give a resol resin having a suitable molecular weight, which is dehydrated and concentrated in vacuo. At the resol resin temperature of 90W110°C, a novolak resin having a softening point ≥110°C is incorporated into the resin, and the mixture is cooled to form a self-curing solid resol resin composition. If the resin temperature is below 90°C, the dehydration is insufficient. If the temperature exceeds 110°C, the curing tends to proceed. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Takaaki Sakamoto
  • 👤 Naokatsu Fujita
  • 👤 Taro Fukui

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 07:04
CPC Classifications
—

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