Brazing method by nickel-phosphorus alloy

Abstract

Abstract PURPOSE: To enable brazing to be performed without producing any well of nickel- braze alloy by covering an electroless nickel layer with a copper plating layer and performing brazing with nickel-phosphorus alloy at the time of manufacturing stems for semiconductor devices, etc. CONSTITUTION: In brazing an iron-made stem 1 of stem for semiconductor devices and a copper pellet 5 or the like provided with an electroless nickel plating layer 8 by means of nickel-phosphorus alloy, a copper plating layer 10 is formed over the entire surface of the assembly of the copper pellet 5 and is then heated to melt the electroless nickel plating layer 8, which is then brazed by the nickel-phosphorus alloy. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Masao Nishiyama
• 👤 Koichi Komoda

Bibliographic Details