Forming of mesa groove

Abstract

Abstract PURPOSE: To obtain a film of uniform thickness, by operating etching with No.1 etching solution via a film having an etching window, and subsequently operating etching with No.2 etching solution, and thereby forming a mesa groove with a circular or obtuse-angled opening part. CONSTITUTION: Etching is done with No.1 etching solution consisting of a mixture of nitric acid 6, fluoric acid 1 and acetic acid 2, in volume ratio, via a film having etching window 2 formed on the surface of semiconductor wafer 1. Subsequently, etching is done with No.2 etching solution consisting of a mixture of nitric acid 5 and fluoric acid 1, in volume ratio. Here, wafer 1 is etched with No.2 etching solution, which has a higher speed than No.1 etching solution, and mesa groove 4 with a circular or obtuse-angled opening part is formed, and thereby a film of uniform thickness is obtained. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Takeshi Yamamoto
• 👤 Ichiro Kume

Bibliographic Details