Hybrid integrated circuit device

Abstract

Abstract PURPOSE: To stably operate this device under a condition that outside circuits do not interfere, by coating this device with insulating resin, and by covering a surface of the insulating resin with conductive resin. CONSTITUTION: An insulating substrate 4 provided with a back conductor layer 2 and a surface conductor layer 3 is melting sticked on a conductor substrate 1 in metal. A circuit element 5 of a transistor, a condenser, a coil, etc. is installed onto the conductor layer 3 on the substrate 4, and this hybrid integrated circuit device formed is coated with insulating resin 6. The whole surface of the resin 6 on a surface of this device is covered with conductive resin 7, and internal parts, etc. are shielded by the resin 7 in the substrate 1, thus ensuring action that is not interfered by means of outside circuits and is stable. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Tetsuo Kobayashi

Bibliographic Details