Semiconductor device

Abstract

Abstract PURPOSE: To reduce size of a package by narrowing space between lead wires by making a ceramic base into a circular shape and also by forming a finger pad and a lead pad into radial shape toward center of the ceramic base. CONSTITUTION: A ceramic base 7 supporting a semiconductor wafer 2 is made into a circular shape. And a finger pad 6 which is for electrical connection between the ceramic base and an element of the semiconductor wafer 2, and a lead pad 5, which is for electrical connection among an outside lead wire 4 and the finger pad 6, are formed into radial configuration toward center of the ceramic base 7. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Eiji Aoki
• 👤 Masahiro Sugimoto

Bibliographic Details