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JPS5540076A Expired / Lapsed JP ⏱️ 0.0 years remaining

Soldering method of automatic soldering device

Assignee: Toshiba Corp
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Filing: 1978-09-14
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Granted: —
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Expires: 1998-09-14
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Abstract

Abstract PURPOSE: To make it possible to perform satisfactory soldering by soaking the printing distributing board which has been made stationary above the solder tank, into solder in order from its one end part, subsequently drawing it up in order from one end part. CONSTITUTION: When the carrier 12 is stopped directly above the solder tank 16, the cylinder parts 581, 582 are driven, the pistons 581, 572 are moved in the direction as indicated with an arrow, and the driving part 56 is coupled with the carrier 12. Subsequently, the driving part 56 is moved further downward, and the printing distributing board 29 mounted to the carrier 12 is soaked into solder 52 of the solder tank 16. In this case, the pistons 571, 572 carry out different movements, respectively, the distributing board 29 is soaked in order extending over to the other end part from one end part, is drawn up in order from one end part after it has been soaked horizontally. In this case, it is perferable that the first end part is soaked at a high speed and gradually at a low speed as soaking proceeds to the other end part, while in case of drawing up, the first end part is made at a low speed in reverse, and it is changed to a high speed gradually as it proceeds to the other end part. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Takehiro Kudo
  • 👤 Terumi Nakahara
  • 👤 Sueo Yamada
  • 👤 Yoshiharu Fukuchi

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-09 05:15
CPC Classifications
—

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