Method of removing resin burr and metal mold

Abstract

Abstract PURPOSE: To remove easily a resin burr is a dam by fitting a projetion to the resin burr and pushing the projection when a semiconductor pellet is fixed in the tab part of a lead frame and molded. CONSTITUTION: A semiconductor pellet 2 is fixed to a given place of a lead frame 1 punched in a metal plate and the semiconductor pellet 2 and a lead piece of the lead frame 1 are connected by a bonding wire and then on upper and a lower metal mold 71, 72 are combined. When they 71, 72 are placed face to face through the lead feame, a main space 5 having the same shape as the external one of resin in a semiconductor device is formed and auxiliary spaces are set in which the sectional size of the space between the upper and the lower mold 71, 72 becomes larger than that of the lead frames as they approach the dam parts 15. When resin is poured in these spaces and hardens, the projection which is formed in the auxiliary spaces is pushed in the direction normal to the lead frames 1 and burrs are removed. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Hiroshi Takao

Bibliographic Details