Producing method of resin mold type semiconductor device

Abstract

Abstract PURPOSE: To rationalize sealing work without using a mold, etc. by clipping a package with a springy fixture to be fixed. CONSTITUTION: A package 10 of a desired shape is formed of resin by deviding into a base 10A and a cap 10B; the base 10A is combined with a lead frame; a semiconductor chip is mounted on a tab 12 of the lead frame: the cap 10B is placed for assembling; and, before or after the pouring operation when resin is poured into the package 10 through a port, the package is longitudinally clipped and fixed with a springy fixture 20, as shown in the figures, for sealing. This structure will do away with a transfer-mold press or a high precision mold to rationalize opertion. The suitable material for the fixture 20 are steel, stainless steel, phosphorus bronze, nickel silver, heat-resist steel, etc. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Takehisa Hamano
• 👤 Masaru Tsunetomo

Bibliographic Details