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JPS5529550A Expired / Lapsed JP ⏱️ 0.0 years remaining

Reclamation of thermosetting resin wastes

Assignee: DIC Corp
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Filing: 1978-08-24
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Granted: —
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Expires: 1998-08-24
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Abstract

Abstract PURPOSE: To reclaim the title wastes to a flexible and tough molded article, by bonding chips (powder) of wastes from various thermosetting resins with a specific ether urethane prepolymer. CONSTITUTION: 100 parts by wt. of chips (or powder) of wastes, e.g. thermosetting resins or cork, is coated with about 5W20 parts by wt of a one-pack type ether urethane prepolymer having an average functionality of 2W4 with an isocyanate group content of 2W10%, obtained by reacting a polyol, e.g. ethylene or propylene glycol or trimethylolpropane, with ethylene or propylene oxide and a polyisocyanate, e.g. Tolylene diisocyanate, as a binder, and hot-molded at 50W150°C while being compressed to about 1/2W1/3 of the original volume to give a reclaimed molded article. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Yoshio Nuga
  • 👤 Motoyasu Kunugiza
  • 👤 Akira Mori

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 18:12
CPC Classifications
—

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