Adhesive composition

Abstract

Abstract PURPOSE: To prepare an adhesive composition having high adhesive strength at high temperature, by compounding a thermosetting resin with a polyvinyl acetal obtained by reacting a polyvinyl alcohol having specific polymerization degree with an aldehyde. CONSTITUTION: An adhesive composition composed of (A) a polyvinyl acetal having a degree of acetalization of 50W80 mol% obtained by reacting a polyvinyl alcohol having a polymerization degree of 2500W3000, pref. 2550W2800 and a saponification degree of ≥ 85 mol% with an aldehyde such as formaldehyde, acetaldehyde, butylaldehyde, etc., and (B) a thermosetting resin such as phenolic resin, epoxy resin, etc. The weight ratio of (A) to (B) is 1:4W4:1. The adhesive is especially useful to the applications requiring the heat resistance of the adhesive, e.g. adhesive for printed circuit board, brake shoe, etc. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Isao Karasutani
• 👤 Hirobumi Omura

Bibliographic Details