Wire bonding device

Abstract

Abstract PURPOSE: To suspend a wire bonding device by putting a detection circuit on a closed condition by contact of a detection element and wire element, with the detection circuit contacting with this wire in perfoming a cutting of the wire. CONSTITUTION: When a capillary 5 is shifted from a first bonding position 14 to a second bonding position 16, a clamper 10 is opened, and a tension is given to a wire 2 by the air supplied from a tension giving device 9. Thereafter, the wire 2 has a trouble of cutting. In this case, the wire 2 is loosened the dtection circuit is closed by a contact of the wire 2 with a detection element 4 to suspend an operation of the wire bonding device. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Kiyoshi Kawashima

Bibliographic Details