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JPS5516751A Expired / Lapsed JP ⏱️ 0.0 years remaining

Soldering method

Assignee: Toshiba Corp
•
Filing: 1978-07-24
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Granted: —
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Expires: 1998-07-24
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Abstract

Abstract PURPOSE: To prevent poor quality of soldering by holding the composition of melted solder within a certain range based on the difference in comparison of the wetness of melted solder with the standard characteristics after it is measured. CONSTITUTION: A standard test piece 4 hangs with a hanger 9 of a senser 5 and immersed into a melted solder 3 with a given composition. The standard characteristics of the wetness is plotted in a chart. From the wetness characteristics on the chart, determined are a shift time T during which the thrusting force of the test piece 4 decreases due to insufficient wetness leading to the generation of sucking force accompanied by wetting, and a limit level to which no poor soldering occurs at a saturation value H of sucking force due to wetting. Then, in the actual soldering work, wetness is measured from the values of T and H. The measured value is compared with the limit value for T and H. Based on the difference, the composition of the solder is maintained constant thereby preventing poor soldering. COPYRIGHT: (C)1980,JPO&Japio

Inventors

  • 👤 Mitsuo Shirata
  • 👤 Toshihiro Shima
  • 👤 Yoichiro Maehara
  • 👤 Akira Suzuki

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 12:03
CPC Classifications
G; G01; G01N; G01N13/00; G01N13/02; G01N2013/0225

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