Method and device for washing wafer

Abstract

Abstract PURPOSE: To heighten a washing effect without damaging the main face of a wafer, by placing a vibrator at a small distance from the main face through a washing liquid and causing the vibrator to perform ultrasonic vibration. CONSTITUTION: The wafter 2 is vacuum-attracted on a rest 1 and rotated at a high speed by a vertical shaft. An ultrasonic vibrating horn 4 is placed at the small distance from the surface of the wafer. The washing liquid 3 is supplied to the wafer so that the horn comes into contact with the surface of the liquid. The horn 4 is caused to vibrate vertically while it is moved horizontally, thereby uniformly washing the main face of the wafer. After the washing, the supply of the washing liquid is stopped and the wafer is rapidly rotated to be dried. The washing effect on the wafer is high. COPYRIGHT: (C)1980,JPO&Japio

Inventors

• 👤 Yuzaburo Sakamoto
• 👤 Norimasa Miyamoto
• 👤 Masao Tsugi
• 👤 Kazuo Kaneko
• 👤 Shisei Yoneda

Bibliographic Details