Semiconductor laser device

Abstract

Abstract PURPOSE: To prevent the occurrence of distortions in glass face and striae and foams in the glass and obtain output light of stable beam diameter by hermetically bonding the optical window of drawing out the output light and s supporting member for this window by means of a soft solder metal. CONSTITUTION: The semiconductor laser device is constituted by a metal base part 1, a cylindrical supporting member 2 which supports an optical window 3, a semiconductor laser element 4 which is fixed on a cooling end 9, etc. The bond the optical window and cylindrical part of said semiconductor device, first the cylindrical part 2 is placed on a hot plate 18 and a soft solder metal 15 is placed on the cylindrical part 2. The cylindrical part 2 is held at a temperature higher by about 20 to 100°C than the melting point of the soft solder metal 15 and the optical window 3' having been coated is placed on the specified position. Next, the optical window 3' and cylindrical part 2 are bonded with an ultrasonic bonder chip and these are slowly cooled. Since the optical window 3' having been bonded in this way does not cause softening deformation of the glass, there are virtually no distortions of the glass surface and both bonding strength and air tightness are good. COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Isao Hakamata

Bibliographic Details