JPS548976A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Lsi package
Assignee: NEC Corp
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Filing: 1977-06-22
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Granted: —
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Expires: 1997-06-22
Abstract
Abstract PURPOSE: To fabricate a package which enables high density wiring and high-efficient heat radiation, by connecting a LSI to a ceramic substrate on which a multi-layer circuit has been formed. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Akihiro Dotani
- 👤 Mitsuru Nitta
- 👤 Toshi Sano
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-27 09:54
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
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References Cited (Backward Citations)
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