Manufacture for semiconductor device and its unit
Abstract
Abstract PURPOSE: To increase the washing effect and to reduce the working process, by friction and rubbing cleaning. CONSTITUTION: When the motor 26 is driven, the substrate 17 is upward and it is in contact with the blade 6. The cutting grooves are formed on the substrate 17 by feeding it toward X. At the end of cutting, the tip of substrate is touched on the roller 7, washing water is fed in the roller 7 and it is jetted from the roller grooves. The roller turns and it rubs while blowing out water on the substrate and the cutting trash can completely be removed. The washing effect is very high and unifrom. Since the roller is made of rubber, it does not damage the substrate surface. After washing, the motor 26 is reversed and the substrate is moved downward, and the substrate is moved back by reversing the motor 31. After that, the substrate is dried. With this constitution, the working time can remarkably be reduced. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Hiroichi Arai
Bibliographic Details
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