JPS54868A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Toshiba Corp
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Filing: 1977-06-06
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Granted: —
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Expires: 1997-06-06
Abstract
Abstract PURPOSE: The electrode is buried into the hole drilled on the substrate in such a way that the electrode component surface may be positioned lower then the substrate surface, and the solder is filled at the upper part of the hole. In this way, the solder outflow can be prevented, at the same time securing an assured positioning of the lead wire. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Tamio Saito
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-09 03:15
CPC Classifications
H; H10; H10W; H10W72/00
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Total Claims: 0
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