Thin film type thermal head

Abstract

Abstract PURPOSE: To enhance high speed operation and reliability of a thermal head, by using a mixture of SiC and SiO 2 as an abrasion resistant film. CONSTITUTION: Glass 2 is glazed on insulating substrate 1, such as Al 2 O 3 . On this, heating resistor 3, such as Si-Ta alloy is formed, and further on this, electrode 4, such as Cr-Au is provided for energizing resistor 3. On these, sputtering is effected with a SiC target in an argon gas containing O 2 to form protective film 5 made of Sic-SiO 2 . Since this is operated at a temperature of substrate 1 where alloy formation of resistor 3 and electrode 4 does not occur, no crack occurs on the SiC abrasion resistant film. The abrasion resistance of film 5 slightly decreses, but formation of 1W2 μ thick SiC film on film 5 permits the abrasion resistance to little be lowered. COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Keizaburo Kuramasu
• 👤 Sumio Maekawa
• 👤 Masaji Arai

Bibliographic Details