Wafer aligning unit

Abstract

Abstract PURPOSE: To obtain the alignment accuracy within ± 10 μm, by pushing the wafer again to the member on the chuck, after coarse alignment to the circumference on facet basis with the wafer revolved. CONSTITUTION: The circumference of wafer is turned with the roller 3 and it is aligned with the circumference 5A in about ± 150 μm on facet 5B basis. Next, the linking with the alignment means is released with the automatic hand 6 and the wafer is carried and aligned on the chuck 7. Next, the wafer is pushed at the middle of line typing the centers of the alignment members 8a and 8b with the member 9a. The facet 5B is pushed on the smaller member having the clearance Δa and Δb, is turned by taking the member as the center and the side 5B is pushed on the members 8a and 8b. With this condition, the member 9b is pushed on the member 8C in parallel with the side 5B and the alignment of about ± 10 μm is finished. COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Hiroshi Sato
• 👤 Megumi Takatsu
• 👤 Junji Isohata

Bibliographic Details