Semiconductor device

Abstract

Abstract PURPOSE: To miniaturize a semiconductor device by mounting a semiconductor chips on leads provided to both sides of an insulating film and by electrically and mechanically bonding leads and semiconductor chips together. CONSTITUTION: Bumps 4 and 4' of semiconductor chips 1 and 1' are set and bonded to leads 6 and 7 on both sides of film 5 of an insulator such as polyimide. The body assembled in this way is sealed by resin 8, and fitting semicondcutor chips 1 and 1' to both sides of the film requires a half the occupation area of the film, so that the miniaturization will be realized. COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Kenji Tokuyama

Bibliographic Details