JPS54579A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Resin seal semiconductor device
Assignee: Hitachi Ltd
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Filing: 1977-06-03
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Granted: —
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Expires: 1997-06-03
Abstract
Abstract PURPOSE: To disperse and absorb the thermal stress between sealing resin and package by connecting the empty electrodes of a standard package and dummy pads as well. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Eiji Oi
- 👤 Tadayasu Nakajima
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 06:09
CPC Classifications
—
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