Semicondutor package

Abstract

Abstract PURPOSE: To prevent the occurrence of breaking and cracking and achieve the improvement in reliability by disposing a frame form reinforcing plate formed of an insulator on the bottom side of a substrate and holding the substrate between the reinforcing plate and spacer by way of a glass layer in a semiconductor package of glass ceramic package type. CONSTITUTION: A substrate 10 formed by a metal, a semiconductor circuit element 12 fixed on the substrate 10 and an insulator spacer 14 which has fixed the top of the substrate 10 so as to surround said element 12 by low melting point glass 21 are provided and further a cover body 22 to be hermetically sealed to the to P of the spacer 14 is provided. A frame form reinforcing plate 15 formed by an insulator is disposed to the bottom face side of the substrate 10 of the semiconductor package of this constitution. The substrate 10 is held in sandwich form between this reinforcing plate 15 and the spacer 14 by way of the layer formed by low melting point glass 16, 21, and is thereby fixed. Fitting recesses or fitting projections 17 are provided to the substrate 10 and the fitting projections or fitting recesses fitting to said fitting projections 17 are provided to the reinforcing plate 15 COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Masao Sekihashi
• 👤 Michiaki Furukawa

Bibliographic Details