Semiconductor device

Abstract

Abstract PURPOSE: To assemble the deivce by providing rough surfaces on the main surface of element disposition base floor and thermo-compression-bonding the Si element by way of the gold or gold alloy layer. CONSTITUTION: An element disposition base 12c is formed with orthogonal recesses 10a, 10b which comprise plating gold or silver on the root part of copper or its alloy and driving blade forms. According to this constitution, the compression bonding area increases at the time of compression bonding gold or gold alloy foil and therefore pression force and temperature may be lowered and assembling may be performed without impairing element characteristics COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Takeshi Hashimoto

Bibliographic Details