JPS545380A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Impurity introducing method for semiconductor wafer and its jig
Assignee: Hitachi Ltd
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Filing: 1977-06-15
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Granted: —
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Expires: 1997-06-15
Abstract
Abstract PURPOSE: To enable the use of a thin wafer, by sealing up the wafer into the upper and lower frame bodies containing the groove which supports two sheets two sheets of the semiconductor wafer oppositely inside, supplrting the frame bodies via the basket-type frame body to provide them into process furnace and applying a deposition only to the outer side surface of the exposed wafer. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Isao Shimura
- 👤 Norio Yoshihara
- 👤 Ichiro Takei
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 10:03
CPC Classifications
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