JPS5437571A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Formation method of bump eectrode
Assignee: Mitsubishi Electric Corp
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Filing: 1977-08-29
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Granted: —
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Expires: 1997-08-29
Abstract
Abstract PURPOSE: To manufacture a highly reliable bump electrode with strong adhesion by preventing an etching solution from infiltrating into a adhesive surface during the formation of the bump electrode. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Masahiro Sekine
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 16:27
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012
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