JPS5419652A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Lead bonding method
Assignee: Hitachi Ltd
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Filing: 1977-07-15
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Granted: —
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Expires: 1997-07-15
Abstract
Abstract PURPOSE: To achieve the reduction in bonding defects by deforming the ends of leads. COPYRIGHT: (C)1979,JPO&Japio
Inventors
- 👤 Toru Kawanobe
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 20:04
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701
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