JPS5388573A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Production of beam lead type semiconductor device
Assignee: NEC Corp
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Filing: 1977-01-13
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Granted: —
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Expires: 1997-01-13
Abstract
Abstract PURPOSE: To avert contacting of the main surface of a device directly to wax material and prevent contamination by using two kinds of dry type photosensitive resin films of different materials and facilitate treating pellets after holding them without separating to discrete pellets by treating the third resin film in the state of the substrate. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Masaru Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-06 06:37
CPC Classifications
H; H10; H10W; H10W72/00
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