JPS5386569A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor pellet forming method
Assignee: Toshiba Corp
•
Filing: 1977-01-11
•
Granted: —
•
Expires: 1997-01-11
Abstract
Abstract PURPOSE: To reduce cracking defects and remove broken layers formed on the back along scribe scores without giving any effect on element forming regions by abolishing cracking the wafer from its element formed surface and cracking it from its back. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Masanobu Ogino
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-08 17:12
CPC Classifications
—
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.