JPS5371A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Scribing method of semiconductor wafer
Assignee: NEC Home Electronics Ltd
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Filing: 1976-06-23
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Granted: —
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Expires: 1996-06-23
Abstract
Abstract PURPOSE: To obtain a stabilized quality element with reduced micro cracks by scribing Si wafer through laser beams irradiated through on the glass protection film. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Yoshihiko Muraki
- 👤 Masao Kachi
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-24 05:20
CPC Classifications
—
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