JPS5368970A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Solder electrode structure
Assignee: Hitachi Ltd
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Filing: 1976-12-01
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Granted: —
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Expires: 1996-12-01
Abstract
Abstract PURPOSE: To improve the moisture resistance of a semiconductor element by forming an underlying metal layer on the first insulating and protecting film selectively covering wiring layers and forming a second insulating and protecting film selectively on this thereby defining the shape of solder electrodes. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Ryosaku Kanzawa
- 👤 Yoshikazu Hosokawa
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-02 17:14
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012
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