JPS5353256A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Mitsubishi Electric Corp
•
Filing: 1976-10-25
•
Granted: —
•
Expires: 1996-10-25
Abstract
Abstract PURPOSE: To obtain a semiconductor device featuring a large capacity and stabilized quality, by securing a low resistance contact with a substrate with no use of Al layer for the layer which is adhered directly to the semiconductor substrate and having an adhesion structure using a chemically stable metal layer. COPYRIGHT: (C)1978,JPO&Japio
Inventors
- 👤 Yoshihiko Hirose
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 21:17
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W20/00; H10W20/40; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.